Avient Corporation, a premier provider of specialized and sustainable material solutions and services, launched a new generation of Edgetek™ 3D/LDS solutions in Asia. These materials were developed to help manufacturers of 3D molded interconnect devices (MIDs) using laser direct structuring (LDS) to meet critical requirements, such as high design flexibility, multi-function integration, miniaturization, and weight reduction.
Standard formulations in polycarbonate (PC), polyphenylene sulfide (PPS), and liquid crystal polymers (LCP) can be tailored to specific needs.
“Increased integration of electronic and mechanical functions using MIDs can meet the challenge that many industries and markets face; namely, finding simple, light weight components without compromising production efficiency and increasing cost,” said Flight Xu, general manager, Specialty Engineered Materials Asia, Avient. “Our 3D/LDS technology responds to the growing needs of the market, offering fewer process steps, shorter assembly times, and a cost-efficient profile.”
Currently, 3D MIDs with LDS technology are widely used in antennas (consumer electronics), automotive components, medical devices, and 5G base stations. The new Edgetek formulations also can help electronic component manufacturers to miniaturize mechanical and electrical (also known as mechatronics) systems, even in high heat manufacturing processes, such as SMT (surface mount technology).
NOTE: On July 1, 2020, PolyOne and Clariant Masterbatches joined together as Avient, a new kind of materials company focused on conquering customer challenges and unlocking the potential for innovation and sustainability around the globe
